2UUL BG01 ABCD Reballing Stencil for iPh 8-16PM (4pcs/pack

The Ultimate Reballing Solution for the Modern Technician

Consistency is the most important factor in BGA repair. The 2UUL BG01 ABCD Set (2026 Edition) is designed to provide ultra-accurate alignment and uniform solder paste distribution, minimizing the risk of bridged pins or weak connections on high-density iPhone motherboards.

Key Features:

• Comprehensive 4-Piece “ABCD” Coverage:

  • A/B/C/D Modules: Specifically partitioned to cover every major IC from the legacy iPhone 8 all the way to the latest iPhone 16 Pro Max.

  • Includes specialized layouts for A-Series CPUs, Baseband (Signal) processors, PMICs, and FaceID/TouchID components.

• Precision Laser-Cut Square Holes: Unlike traditional round-hole stencils, 2UUL’s square-hole technology facilitates easier solder paste release and prevents the stencil from “sticking” to the board after heating.

• High-Temperature Deformation Resistance: Manufactured from imported Japanese high-toughness steel, these stencils can withstand repeated heating cycles without warping or bulging.

• Anti-Stick Surface Treatment: The surface is chemically polished to reduce friction, ensuring that solder balls remain perfectly spherical and seated on the pads.

• 0.12mm Optimized Thickness: Precisely calibrated to provide the ideal volume of solder paste for modern, low-profile iPhone chips, preventing “overflow” during the reflow process.

• Clear Identification Markings: Each stencil is clearly laser-etched with model compatibility, making it easy to find the correct grid under the microscope.

Technical Specifications:

• Brand: 2UUL

• Model: BG01 (ABCD Set)

• Compatibility: iPhone 8, 8P, X, XS, XR, XS Max, 11 Series, 12 Series, 13 Series, 14 Series, 15 Series, 16 Series.

• Material: High-Grade Stainless Steel

• Hole Type: Precision Square Hole

• Quantity: 4 Stencils per Pack