2UUL BG02 UNIVERSAL REBALLING STENCIL

Precision Engineering for Flawless BGA Restoration

In the world of micro-soldering, the quality of your stencil determines the success of your reballing. The 2UUL BG02 is designed to eliminate the common frustrations of “bridged” solder balls and warped stencils, providing a reliable foundation for repairing iPhone and Android logic boards.

Key Features:

• Universal Compatibility Matrix: Designed as a “multi-purpose” solution, the BG02 features a comprehensive grid of various hole sizes and pitches. This makes it an essential tool for technicians who work on a diverse range of Android chipsets and legacy iPhone components.

• Ultra-Precise Square Hole Design: Unlike cheaper round-hole stencils, the BG02 utilizes precision-cut square holes with tapered walls. This facilitates easier solder paste release and ensures that every solder ball is uniform in height and volume.

• 0.12mm Standard Thickness: The stencil is calibrated to a $0.12\text{mm}$ thickness, providing the ideal amount of solder paste for modern high-density PCBs without causing shorts between pads.

• Superior Heat Resistance: Forged from high-grade stainless steel with anti-drum technology. It maintains its flatness even under the intense heat of professional hot air stations, preventing solder paste from leaking underneath.

• Laser-Cut Alignment: Every hole is laser-etched for microscopic accuracy. This reduces the time spent on alignment and ensures that the solder balls sit perfectly on the IC pads.

• Anti-Corrosion Surface: The steel is treated to resist the aggressive chemicals found in high-activity soldering fluxes, ensuring the stencil remains smooth and clean after hundreds of uses.

• Application Scope:

  • Power ICs (PMIC)

  • Audio Chips & Codecs

  • Baseband & RF Transceivers

  • Charging & USB Control ICs

Technical Specifications:

• Brand: 2UUL

• Model: BG02 (Universal Series)

• Material: High-Hardness Japanese Steel

• Thickness: $0.12\text{mm}$

• Hole Type: Precision Square/Round Hybrid

• Application: Universal BGA Reballing, IC Maintenance, GSM Repair.