2UUL BH17 CPU Reball Base – Magnetic Dual-Sided High-Precision Reballing Platform
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Pick up from the Pick Up Point
To pick up today
Free
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Courier delivery
Our courier will deliver to the specified address
3-5 Days
From L 120
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Maseru CBD Delivery
Local courier will deliver to the specified address At Maseru Local
1-2 Days
From L 50
- Note: Delivery service fee may apply and will be calculated at the checkout page based on your billing address and the applicable rates.
L 750.00
Description
The Master Solution for Advanced IC Rework
In the world of micro-soldering, CPU reballing is the most demanding task. The 2UUL BH17 is engineered to remove the guesswork by providing a perfectly balanced, magnetic environment that secures both the chip and the stencil with industrial-grade force.
Key Features:
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75-Piece Comprehensive Stencil Set: A massive library of stencils covering Apple A10 through A19 Pro, Qualcomm Snapdragon (up to 8 Gen 3/Ultra), Samsung Exynos, MediaTek Dimensity, and HiSilicon Kirin series.
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Dual-Thickness Alignment: * T0.6 Side: Optimized for the specific height and thermal requirements of Apple A-series processors.
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T0.35 Side: Tailored for the thinner profiles of Android CPUs and EMMC/UFS memory chips.
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Ultra-Strong Magnetic Fixation: Built-in rare-earth magnets hold the chip and stencil in a “dead-lock” position. This prevents the stencil from warping or lifting during the application of hot air, ensuring consistent solder ball height across the entire BGA grid.
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High-Precision CNC Machined Base: The platform is crafted from a combination of high-density synthetic stone and premium alloys, providing excellent heat insulation and a weighted, non-slip foundation for microscope work.
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Optimized for Batch Repair: The “Quick-Fix” design allows technicians to swap chips and stencils in seconds, significantly increasing productivity in high-volume repair labs.
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Mirror-Finish Solder Joints: When used with high-quality solder paste, the BH17 ensures perfectly spherical, uniform solder balls that facilitate a successful “first-time” reflow on the motherboard.
Technical Specifications:
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Brand: 2UUL
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Model: BH17 (CPU Reball Base)
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Stencil Count: 75 Specialized High-Precision Templates
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Materials: Magnetic Alloy + Heat-Resistant Synthetic Stone + Stainless Steel (Stencils)
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Compatibility: Universal (iPhone 7 to 17 Pro Max, Samsung S24/S25/S26, Xiaomi 15/17, etc.)
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Platform Dimensions: $58\text{mm} \times 58\text{mm} \times 11\text{mm}$

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